• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to a method for producing a metallic insert for a printed circuit board, with the provision of a metal plate (1); Producing a recess (5) along a dividing line (8) on a flat side (3) of the metal plate (1); Production of an opposite depression (6) along the dividing line on an opposite flat side (4) of the metal plate (1), such that the opposite depression (6) is arranged opposite the depression (5) and between the depression (5) and the opposite A residual material web (7) is produced in the recess (6) along the dividing line; and producing a metallic insert, the metal plate (1) being separated along the residual material web (7). Furthermore, a method for producing an arrangement for a printed circuit board with a metallic insert, a metallic insert and a printed circuit board are provided.
    公开号:CH716650A2
    申请号:CH01134/20
    申请日:2020-09-10
    公开日:2021-03-31
    发明作者:Georgiev Georgi；Fiehler Ralph；Jelitzki Raik
    申请人:KSG GmbH；
    IPC主号:
    专利说明:

    description
    The invention relates to a method for producing a metallic insert for a printed circuit board, a method for producing an arrangement for a printed circuit board with a thick metal insert, a metallic insert and a printed circuit board.
    background
    In connection with printed circuit boards, it is known to embed metallic inserts, which are also referred to as thick metal inserts, which serve to improve the thermal management in the printed circuit board, in the layer composite of the printed circuit board. During the operation of components with which the circuit board is equipped, the heat that occurs can be better dissipated. As an alternative or in addition, the metallic inserts, which are also referred to as inlays or coins, can be used to conduct high currents (high-current applications).
    Presentation of the invention
    The object of the invention is to provide improved technologies for printed circuit boards with metallic inserts. This relates in particular to the production of such metallic inserts themselves as well as their embedding in a layer composite of the circuit board.
    To solve a method for producing a metallic insert for a printed circuit board and a method for producing an arrangement for a printed circuit board with a metallic insert according to the independent claims 1 and 9 are created. Furthermore, a metallic insert for a circuit board and a circuit board according to the independent claims 10 and 14 are created. Refinements are the subject of the dependent claims.
    According to one aspect, a method for producing a metallic insert for a printed circuit board is provided. In the method, a metal plate is provided. On one flat side of the metal plate, a recess is made along a dividing line, and on an opposite flat side of the metal plate, an opposite recess is made along the dividing line, in such a way that the opposite recess is arranged opposite the recess and between the recess and the opposite recess along the Parting line a residual material web is produced. A metallic insert is then produced, with the metal plate being separated along the residual material web.
    According to a further aspect, a method for producing an arrangement for a printed circuit board with a metallic insert is created, in which a layer composite is formed with a conductor layer made of an electrically conductive material and at least two insulating layers made of an electrically insulating material, in at least a metallic insert is introduced into one of the at least two insulating layers.
    According to another aspect, a metallic insert for a printed circuit board is provided which has a flat metallic insert body, in which a web projection is arranged on one end or narrow side, which extends in the longitudinal direction of the end face.
    Furthermore, a circuit board is provided with a layer composite with a conductor layer made of an electrically conductive material and at least two insulating layers made of an electrically insulating material, in which such a metallic insert is arranged in at least one of the at least two insulating layers. The metallic insert can be arranged in an internal insulating layer.
    As a material for the metal plate, for example, copper or aluminum can be used.
    With the help of the opposing depressions on the two flat sides of the metal plate along the dividing line, the metal plate is prepared in order to then produce the metallic insert by means of separation, which can also be referred to as a thick metal insert. The separation can be carried out in various ways, for example by means of a break along the separation line, so that a break edge is created on a narrow or front side of the metallic insert. After the mutually opposite depressions have been produced, a predetermined breaking point extends along the dividing line.
    The depressions and the opposite depression can each be made as a groove.
    The metal plate can for example have a thickness of about 0.5 mm to about 2.5 mm. The metallic insert then has the thickness of the metal plate.
    The recess and the opposite recess can be made with a substantially equal depth. Alternatively, the two depressions on the flat sides of the metal plate can be designed with different depths. With essentially the same depth, the residual material web is formed in the central area of the metal plate.
    The recess and / or the opposite recess can be made in cross section with a V or a U shape. In the case of the V-shape, the tip formed on the residual material web can be rounded. Sidewall areas of the indentations can also be curved, for example outwardly with respect to the indentation.
    The depression and / or the opposite depression can be produced by means of a machining process. For example, a scoring or notching tool can be used which rotates when the indentations are made. A production of the depressions by means of laser processing can also be provided. In these or other embodiments, the depressions can be produced at least partially simultaneously on the two flat sides of the metal plate. In the case of the use of scoring tools, these can be operated in the opposite direction on the two opposite sides of the metal plate if the depressions are made on the flat sides. The depressions can alternatively be produced by means of a milling tool, optionally one after the other in terms of time.
    The residual material web can be produced with a web height between about 15% and about 35% of the material thickness of the metal plate. In one embodiment, a web height between approximately 0.15 mm and approximately 0.35 mm can be provided, alternatively with a web height between approximately 0.20 mm and approximately 0.30 mm.
    The metallic insert can be produced on at least two opposite sides by means of cutting along the dividing line. This means that, at least on the two opposite sides, the residual material web was produced before the separation. In one embodiment, the production of the depressions and the subsequent separation take place circumferentially on all sides during the production of the metallic insert.
    The metallic insert can be produced on a narrow or end face with a web projection, which is formed after the separation of a portion of the residual material web remaining on the end face and extends in the longitudinal direction of the end face. In this embodiment, a remaining section remains of the residual material web during and after the separation along the separating line, with which the web projection protruding on the end face is formed. Above and below the web projection, the surface on the end face of the metallic insert is set back opposite the web tip. These surface sections can run essentially in the horizontal direction or at an angle to the horizontal. After the separation, the web projection can remain unprocessed. Optionally, provision can be made for the web projection remaining on the end face after the separation to be machined, for example partially removed, for example in order to carry out a partial smoothing. If the separation takes place along the separation line by means of a break, the break edge that is created along the web projection can remain unprocessed or can be processed as explained above. In this or other embodiments, the web projection can be formed continuously along the respectively assigned end face on the latter. Alternatively, provision can be made for the remaining section of the residual material web, which forms the web projection, to be removed in one or more subregions along the narrow side by means of post-processing. In this way, the web projection along an end face of the metallic insert part can be designed as a projection interrupted in the longitudinal direction of the end face.
    The metal plate before the separation and / or the metallic insert after the separation can be processed to enlarge the surface. The surface enlargement produced here, be it on the flat sides and / or the end faces of the metallic insert, improves the adhesive bond between the metallic insert and the electrically insulating material in the insulating layer of a printed circuit board. For example, it can be provided to use an oxidation reaction in order to carry out the surface enlargement (surface roughening). Methods of this type are known as such in various embodiments.
    The embodiments explained above can be provided accordingly in connection with the method for producing an arrangement for a circuit board, the metallic insert and / or the circuit board.
    [0021] Further configurations of the metallic insert part can relate to the following. The web projection can be formed at least on two opposite narrow or front sides of the insert body. A side surface section can be designed above and or below the web projection on the narrow side at an angle to the level of the insert or insert body. The web projection can have a rounded web tip.
    Description of exemplary embodiments
    In the following, further exemplary embodiments are explained in more detail with reference to figures of a drawing. Here show:
    Fig. 1 is a schematic representation of a metal plate;
    FIG. 2 shows a schematic representation of the metal plate from FIG. 1, with depressions on one flat side
    are introduced;
    FIG. 3 shows a schematic illustration of the metal plate from FIG. 2, with on an opposite one
    Flat side opposite recesses are made;
    4 shows a schematic representation of a metallic insert in cross section; and
    5 shows a schematic representation of a section of a printed circuit board with a metallic insert
    part in cross section.
    With reference to Figures 1 to 4, a method for producing a thick metal insert for a printed circuit board will be described below. Fig. 1 shows a schematic representation of a metal plate 1, for example copper or aluminum, in cross section. The metal plate can, for example, have a thickness between approximately 0.5 mm and approximately 3.5 mm.
    In the process of producing a metallic insert 2 (see FIG. 4), a recess 5 and an opposite recess 6 are made on the flat sides 3, 4 of the metal plate 1. In the embodiment shown, the two depressions 5, 6 are each made with a V-shape rounded at the tip of the depression. Alternatively, a substantially U-shaped cross-sectional configuration can be provided. A residual material web 7 is produced between the two depressions 5, 6. The residual material web 7 has a web height. The web height of the residual material web 7 can preferably be between approximately 15% and approximately 35% of the plate thickness of the metal plate 1.
    To produce the two depressions 5, 6, different processing methods can be used to carry out the material removal. In one embodiment it is provided that the two depressions 5, 6 are produced with a respective scoring or notching tool (not shown). If the two depressions 5, 6 are produced essentially at the same time, the scoring tools can be operated rotating in opposite directions. In this embodiment, a notch-scoring process is used to produce the depressions 5, 6 in such a way that the residual material web 7 remains between the two opposite depressions 5, 6.
    [0026] As an alternative or in addition, laser processing can be used to produce the depressions 5, 6.
    The residual material web 7 runs along a dividing line 8, along which adjacent sections 9, 10 of the metal plate 1 are then separated from one another. This creates the metallic insert 2, which is shown in FIG. 4.
    The separation of the adjacent sections 9, 10 can be carried out with the aid of various separation methods. In one embodiment, it can be provided to perform a break separation, so that break edges or webs arise along the separating line 8 on the two sections 9, 10 of the metal plate 1.
    According to FIG. 4, the metallic insert 2 has, on opposite narrow sides 11, 12, a respective web projection 11a, 12a, which is formed by a remaining part of the residual material web 7, which remains on the respective narrow side 11, 12 after separation. Above and below the web projection 11a, 12a, surfaces 13, 14 on the narrow side 11, 12 run obliquely to the horizontal direction, which in the exemplary embodiment shown is in particular the result of the V-shaped design of the two depressions 5, 6. The design (surface shape) on the narrow sides 11, 12 that occurs during separation can remain unchanged (unprocessed) for the metallic insert 2 after separation. Alternatively, post-processing can be provided, for example for deburring. The surface on the narrow sides 11, 12 can also be produced free of fraying or splinters by means of post-processing.
    To further improve the integration of the metallic insert 2 in a printed circuit board (cf. FIG. 5) it can be provided that the outer surface of the metallic insert 2 is oxidized completely or in partial areas. This increases the surface area so that the material of the insulating layer of the circuit board adheres more strongly to the surface of the thick metal insert. Oxidation processes for this are known as such in various embodiments. During the production of the metallic insert 2, provision can be made for the oxidation process for the metal plate 1 to be carried out so that its surfaces are oxidized on the flat sides 3, 4, be it before and / or after the production of the two depressions 5, 6 are made before the oxidation process, the surfaces of the two depressions 5, 6 are also oxidized. As an alternative or in addition, provision can be made for the oxidation process to be carried out after the metal insert 2 has been separated.
    The metallic insert 2 can then be embedded in one of the insulating layers of the circuit board during the production of a circuit board. 5 shows an example of a printed circuit board 20 in cross section, in which the metallic insert 2 is embedded in an insulating layer 21. The metallic insert 2 is connected via plated-through holes 22 to external conductor layers 23, 24, which are partially covered with a solder resist coating 25. Alternatively, solder mask coatings can be omitted. As a result, thermal energy that arises during the operation of components which can be mounted on the circuit board 20 in the area of the conductor layers 23, 24 can be efficiently distributed and dissipated. The plated-through holes 22 are therefore also referred to as thermal contacts (thermal vias). Alternatively or in addition, a metallic insert, comparable to the metallic insert 2 in FIG. 5, can be used to conduct high currents in the layer composite of the printed circuit board 20. High currents in the context of the present disclosure are currents of at least 20 A, alternatively of at least 30 A. The currents can be up to 100 A.
    For a through-hole plating, a bore 26 is provided, which can be at least partially filled with a metallic material, for example copper, or a thermally conductive non-metallic material. Furthermore, an inner conductor layer 27 is formed in the exemplary embodiment.
    The features disclosed in the above description, the claims and the drawing can be important both individually and in any combination for the implementation of the various designs.
    权利要求:
    Claims (14)
    [1]
    1. Method for producing a metallic insert for a printed circuit board, with
    - providing a metal plate (1);
    - producing a recess (5) along a dividing line (8) on a flat side (3) of the metal plate (1);
    - Production of an opposite depression (6) along the dividing line (8) on an opposite flat side (4) of the metal plate (1), in such a way that the opposite depression (6) is arranged opposite the depression (5) and between the depression (5 ) and the opposite recess (6) along the dividing line (8) a residual material web (7) is produced; and
    - Production of a metallic insert (2), the metal plate (1) being separated along the residual material web (7).
    [2]
    2. The method according to claim 1, characterized in that the recess (5) and the opposite recess (6) are produced with a substantially equal depth.
    [3]
    3. The method according to claim 1 or 2, characterized in that the recess (5) and / or the opposite recess (6) are produced in cross section with a V or a U shape.
    [4]
    4. The method according to at least one of the preceding claims, characterized in that the recess (5) and / or the opposite recess (6) are produced by means of a machining process.
    [5]
    5. The method according to at least one of the preceding claims, characterized in that the residual material web (7) is produced with a web height between about 15% and about 35% of the material thickness of the metal plate (1).
    [6]
    6. The method according to at least one of the preceding claims, characterized in that the metallic insert (2) is produced at least on two opposite sides by means of cutting along the dividing line (8).
    [7]
    7. The method according to at least one of the preceding claims, characterized in that the metallic insert (2) is produced on one end face (11; 12) with a web projection (11a; 12a) which, after being separated from one on the end face (11 ; 12) the remaining portion of the residual material web (7) is formed and extends in the longitudinal direction of the end face (11; 12).
    [8]
    8. The method according to at least one of the preceding claims, characterized in that the metal plate (1) before the separation and / or the metallic insert (2) is processed to enlarge the surface after the separation.
    [9]
    9. A method for producing an arrangement for a printed circuit board with a metallic insert, in which a layer composite is formed with a conductor layer made of an electrically conductive material and at least two insulating layers made of an electrically insulating material, with a metallic layer in the at least one of the at least two insulating layers Insert (2) is introduced, which is produced by a method according to at least one of the preceding claims.
    [10]
    10. Metallic insert (2) for a circuit board, with a flat metallic insert body, in which a web projection (11a; 12a) is arranged on one end face (11; 12) which extends in the longitudinal direction of the end face (11; 12).
    [11]
    11. Metallic insert (2) according to claim 10, characterized in that the web projection (11a, 12a) is formed at least on two opposite end faces (11, 12) of the insert body.
    [12]
    12. Metallic insert (2) according to claim 10 or 11, characterized in that a side surface section (13; 14) above and / or below the web projection (11a; 12a) on the end face (11; 12) is inclined to the level of the insert body is.
    [13]
    13. Metallic insert (2) according to at least one of claims 10 to 12, characterized in that the web projection (11a; 12a) has a rounded web tip.
    [14]
    14. Printed circuit board, with a layer composite with a conductor layer made of an electrically conductive material and at least two insulating layers made of an electrically insulating material, a metallic insert (2) according to at least one of claims 10 to 13 being arranged in at least one of the at least two insulating layers.
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    同族专利:
    公开号 | 公开日
    DE102019125449A1|2021-03-25|
    AT522987A2|2021-04-15|
    AT522987B1|2021-12-15|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    JP2587462B2|1988-07-08|1997-03-05|株式会社フジクラ|Enamel substrate and method of manufacturing the same|
    JPH0266182A|1988-08-31|1990-03-06|Fujikura Ltd|Enameled substrate|
    JPH03252191A|1990-03-01|1991-11-11|Matsushita Electric Ind Co Ltd|Metal base material insulating board|
    JP2010278309A|2009-05-29|2010-12-09|Sanyo Electric Co Ltd|Method of manufacturing circuit board and method of manufacturing circuit device|
    KR20120091689A|2011-02-09|2012-08-20|삼성전자주식회사|Substrate cutting apparatus and method of cutting the substrate using the same|
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    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102019125449.3A|DE102019125449A1|2019-09-20|2019-09-20|Method for producing a metallic insert and an arrangement for a printed circuit board, metallic insert and printed circuit board|
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